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Most Recent Publications:(1) J. Han*, F. Guo, J.P. Liu, Early Stages of Localized Recrystallization in Pb¨CFree BGA Solder Joints Subjected to Thermomechanical Stress, J. Alloys Compd. 704 (2017) 574¨C584.(2) J. Han*, F. Guo, J.P. Liu, Recrystallization Induced by Subgrain Rotation in Pb¨Cfree BGA Solder Joints Under Thermomechanical Stress, J. Alloys Compd. 698 (2017) 706¨C713.(3) J. Han*, F. Guo, J.P. Liu, Effects of Anisotropy of Tin on Grain Orientation Evolution in Pb¨Cfree Solder Joints Under Thermomechanical Stress, J. Mater. Sci. Mater. Electron. (2017). doi:10.1007/s10854-017-6347-2.(4) J. Han*, S.H. Tan, F. Guo, Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint during Thermal Shock, J. Electron. Mater. 45 (2016) 6086¨C6094.(5) S.H. Tan, J. Han*, F. Guo, Subgrain Rotation at Twin Grain Boundaries of a Lead¨CFree Solder Joint during Thermal Shock, J. Mater. Sci. Mater. Electron. 27 (2016) 9642¨C9649.(6) Y. Wang, J. Han, L. M. Ma, Y. Zuo, F. Guo*, Electromigration Behaviors of Cu Reinforced Sn¨C3.5Ag Composite Solder Joints, J. Electron. Mater. 45 (2016) 6095¨C6101.(7) P.H. Gu, J. Han, F. Guo*, Effects of Nano-Structured Reinforcements on the Recrystallization and Damage Mode of Sn¨C3.0Ag¨C0.5Cu Solder Joints, 17th International Conference on Electronic Packaging Technology, Aug. 2016.

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