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[1] Zhou Minbo. Qin Hongbo, Ma Xiao£¬et al£¬Interfacial reaction and melting/solidification characteristics between Sn and different metallizations of Cu, Ag, Ni and Co£¬2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010£¬202-207. (EIÊÕ¼)[2] Yue Wu, Zhou Minbo£¬Qin Hongbo£¬et al£¬A comparative investigation of the electromigration behavior between wedge-type and line-type Cu/Sn3.0Ag0.5Cu/Cu interconnects£¬2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011£¬971-975. (EIÊÕ¼)[3] Li Xunping£¬Xia Jianmin£¬Qin Hongbo£¬et al. Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints£¬2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012£¬356-360. (EIÊÕ¼)[4] Li Wei£¬Zhou Minbo. Qin Hongbo, Zhang Xinping, et al. Experimental and numerical study of the size effection microstructure and mechanical behavior of Cu/Sn0.7Cu0.05Ni/Cu joints with very small solder volume£¬2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012£¬749-754. (EIÊÕ¼)[5] Li Xunping£¬Qin Hongbo£¬X.P. Zhang et al£¬Loading rate and size effect on the fracture behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects£¬2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012£¬1298-1302. (EIÊÕ¼)[6] Wu. Yue£¬Qin Hongbo£¬Zhou Minbo£¬et al. Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints£¬2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP, 2012£¬1320-1325. (EIÊÕ¼)[7] Yue Wu£¬Qin Hongbo£¬Zhou Minbo, et al. Influence of pre-existing void in the solder joint on electromigration behavior of Cu/Sn58Bi/Cu joints£¬2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013£¬1005-1009. (EIÊÕ¼)[8] Li Wangyun£¬Qin Hongbo£¬Zhou Minbo£¬et al. The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints£¬2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014£¬1030-1034. (EIÊÕ¼)[9] ÔÀÎ䣬Çغ첨£¬ÖÜÃô²¨£¬ÕÅÐÂƽ.½á¹¹±ä»¯¶ÔCu/Sn-58Bi/Cu΢º¸µãµçǨÒÆÐÐΪºÍ×éÖ¯ÑݱäµÄÓ°Ï죬½ðÊôѧ±¨£¬2012£¬48£¨6£©£º678-686. (SCIÊÕ¼)[10] Yue Wu£¬Qin Hongbo£¬Zhou Minbo, et al. Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing£¬Transactions of Nonferrous Metals Society of China£¬2014£¬24£¨5£©£º1619-1628.[11] Yuwen Huihui, Qin Hongbo, Zhang Xinping, et al. The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array, ICEPT, 2015: 568-573.[12] Qin Hongbo, Yue Wu, Zhang Xinping, ea al. Size and geometry effects on the electromigration behavior of flip-chip Sn3.5Ag solder joints, ICEPT, 2015: 651-655. (EIÊÕ¼)[13] Qin Hongbo, Li Bin, et al. Interaction effect between electromigration and microstructure evolution in Cu/Sn-58Bi/Cu solder interconnect. IEEE-ECTC, Florida, 2014: 2249-2254. (EIÊÕ¼)[14] Qin Hongbo, Yue Wu, et al. Interaction effect between electromigration and microstructure evolution in BGA structure solder interconnects, ICEPT, Chengdu, 2014: 10-16. (EIÊÕ¼)[15] Qin Hongbo, Zhang Xinping. Influence of geometry of microbumps on thermal stress and fatigue life of interconnects in copper filled through silicon via structure. ICEPT, Dalian, 2013: 1019-1024. (EIÊÕ¼)[16] Qin Hongbo, Li Xunping, Zhang Xinping. Solder volume effects on the fatigue life of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects. IEEE-EMAP, Hongkong, 2012: 601-607. (EIÊÕ¼)[17] Qin Hongbo, Li Xunping, Zhang XinPing. Influence of thickness of interfacial IMC layer and solder mask layer on mechanical reliability of BGA interconnects.ICEPT-HDP, Guilin, 2012: 714-719. (EIÊÕ¼)[18] Qin Hongbo, Li Bin, Zhang Xinping. Finite element simulation of fracture behavior of BGA structure solder interconnects. ICEPT-HDP, Shanghai, 2011: 991-996. (EIÊÕ¼)[19] Qin Hongbo, Li Bin, Zhang Xinping. Finite element simulation of interfacial fracture and impact behavior at microscale Sn-Ag-Cu solder interconnects. ICEPT-HDP, Xi¡¯an, 2010: 594-600. (EIÊÕ¼)[20] Çغ첨, ÀîÍûÔÆ, Àîѫƽ, ÕÅÐÂƽ. BGA½á¹¹ÎÞǦ΢º¸µãµÄµÍÖÜÆ£ÀÍÐÐΪÑо¿. »úе¹¤³Ìѧ±¨, 2014, 50(20): 54-62. (EIÊÕ¼)[21] Qin Hongbo, Li Wangyun, Zhou Minbo, et al. Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. Microelectronics Reliability, 2014, 54: 1871-1881.? (SCI)[22] Qin Hongbo, Zhang Xinping, Zhou Minbo, et al. Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints. Materials Science and Engineering-A, 2014, 617: 14-23.? (SCI¶þÇø)[23] Qin Hongbo, Zhang Xinping, Zhou MinBo, et al. Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. Microelectronics Reliability, 2015, 55: 1214-1225. (SCI)[24] ÀîÍûÔÆÇغ첨ÖÜÃô²¨ÕÅÐÂƽ.µç-Á¦ñîºÏ×÷ÓÃÏÂCu/Sn-3.0Ag-0.5Cu/Cu΢º¸µãµÄÀ­ÉìÁ¦Ñ§ÐÔÄܺͶÏÁÑÐÐΪ£¬»úе¹¤³Ìѧ±¨£¬2016, 52(10)£¬46-53.£¨EIÊÕ¼£©[25] Wang Sansan, Zhang Ping, Yang Daoguo, Qin Hongbo£¨Í¨ÐÅ×÷Õߣ©, et al. Influence of microstructure inhomogeneity on the electromigration behavior of flip chip solder joints. ICEPT, 2016: 1-6. (EIÊÕ¼)[26] Wang Sansan, Wang Ying, Zhang Ping, Guo Lei, Qin Hongbo (ͨÐÅ×÷Õß), Jiang Hongjie, Yan Hong. 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The electronic properties of zinc-blende GaN, wurtzite GaN and pnma-GaN crystals under pressure. 18 th International Conference on Electronic Packaging Technology, ISBN ?**27, ?1483-1487, 2017, IEEE Inc.?????? EI£¨¼ìË÷ºÅ**244£©.[30] Hongbo Qin, Xinghe Luan, Chuang Feng, Daoguo Yang and Guoqi Zhang. Mechanical, Thermodynamic and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals????? . Materials 2017, 10£¨12£©, 1419. 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