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[1]????? Miao Cai, Daoguo Yang*, Kunmiao Tian,Wenbin Chen, Xianping Chen, Ping Zhang, Xuejun Fan, Guoqi Zhang, A Hybrid Prediction Method on Luminous Flux Maintenance of High-Power LED Lamps, Applied Thermal Engineering, 95 (2016) , pp:482¨C490. 2016. (SCIÊÕ¼, IF: 2.739£¬ÖпÆÔºSCI·ÖÇø´óÀàѧ¿Æ2Çø)[2]????? Zhe Li,?Daoguo Yang*, Weidong Hao, Tiecheng Wu, Song Wu, Xiaoping Li, A novel technique for micro-hole forming on skull with the assistance of ultrasonic vibration, Journal of the Mechanical Behavior of Biomedical Materials, Volume 57, April 2016, Pages 1-13.[3]????? Miao Cai, Daoguo Yang*, Xianping Chen, Ping Zhang, et al. Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method. Microelectronics Reliability, 55 (2015) pp. 1784-1789. (SCI ÊÕ¼)[4]????? Jianlin Huang, Golubovic, D.S. Sau Koh Daoguo Yang, Xiupeng Li, Xuejun Fan, and G. Q. Zhang, ¡°Rapid degradation of mid-power white-light LEDs in saturated moisture conditions,¡± IEEE Transactions on Device and Materials Reliability, Volume: 15, Issue: 4, 2015, pp: 478 - 485. (SCIÊÕ¼)[5]? Jianlin Huang, D. S. Golubovic, Sau Koh, Daoguo Yang, Xiupeng Li, Xuejun Fan, G.Q. Zhang, ¡°Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests,¡±? Microelectronics Reliability£¬55 (2015) , pp: 2654¨C2662. (SCIÊÕ¼)[6]? Miao Cai, Daoguo Yang, Xianping Chen, Ping Zhang, et al. Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method. Microelectronics Reliability, 55 (2015) pp. 1784-1789. (SCI ÊÕ¼)[7]? Zaifu Cui, Miao Cai, Xianping Chen, Daoguo Yang, et al. A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Microelectronics Reliability, 55 (2015) pp. 1877-1881. (SCIÊÕ¼, SCIÊÕ¼, IF: 1.433)[8]? J. Huang, D. S. Golubovic, S. Koh, D. Yang(ÑîµÀ¹ú), X. Li, X. Fan, and G. Zhang, ¡°Degradation modeling of mid-power white-light LEDs by using Wiener process,¡± Optics express, vol. 23, no. 15, pp. A966-A978, 2015. (SCIÊÕ¼)[9]? Jianlin Huang, Dusan S. Golubovic, Sau Koh, Daoguo Yang, Xiupeng Li, Xuejun Fan, and G. Q. Zhang, ¡°Degradation Mechanisms of Mid-power White-light LEDs under High Temperature-Humidity Conditions,¡± IEEE Transactions on Device and Materials Reliability, Vol. 15, No. 2,? 2015, pp. 220-228. (SCIÊÕ¼)[10]? Weijie Liang, Ping Zhang, Xianping Chen, Miao Cai, Daoguo Yang£¬ Genetic Algorithm (GA)-Based Inclinometer Layout Optimization, Sensors, 2015, 15(4), 9136-9155 (SCIÊÕ¼, SCI: **108, IF 2.245)[11]? Ning Yang, Xianping Chen, Tianling Ren, Ping Zhang, Daoguo Yang, ¡°Carbon nanotube based biosensors,¡± Sensors and Actuators B: Chemical, vol. 207 pp. 690¨C715, Oct. 2015. (SCIÊÕ¼, IF: 4.097£¬ 2014ÖпÆÔºSCI·ÖÇø´óÀàѧ¿Æ2Çø)[12]? X.P. Chen , N. Yang, J.K. Jiang, Q.H. Liang, D.G. Yang, G.Q. Zhang, and T.L. Ren, ¡°Ab initio study of temperature, humidity and covalent functionalization induced band gap change of single-walled carbon nanotubes,¡± IEEE Electron Device Letters, vol. 36(6), pp. 606¨C608, Jun. 2015. (SCIÊÕ¼, IF: 2.754£¬2014ÖпÆÔºSCI·ÖÇø´óÀàѧ¿Æ2Çø)[13]? X. P. Chen, J. K. Jiang, Q. H. Liang, N. Yang, H. Y. Ye, M. Cai, L. Shen, D. G. Yang , T. L. Ren, ¡°First-principles study of the effect of functional groups on polyaniline backbone,¡± Scientific Reports, vol. 5, pp: 1690-7, 2015. (SCIÊÕ¼, IF: 5.578£¬2014ÖпÆÔºSCI·ÖÇø´óÀàѧ¿Æ2Çø)[14]? Ping Zhang, Jianhua Zeng, Xianping Chen, Miao Cai, Jing Xiao, DaoGuo Yang. An Experimental Investigation of a 100 W High-power LEDs Array Using Vapor Chamber-based Plate, Advances in Mechanical Engineering, 2015, Vol. 7(11) 1¨C7. (SCIÊÕ¼)[15]????? X. P. Li, Q. Xia, D. Qu, T. C. Wu, D. G. Yang, W. D. Hao, X. Jiang & X. M. Li£¬The Dynamic Dielectric at a Brain Functional Site and an EM Wave Approach to Functional Brain Imaging£¬Scientific Reports, 2014, vol. 4, pp:6893-6893. (SCI ÊÕ¼, IF: 5.578)[16]????? M. Cai, D. J. Xie, W. B. Chen, B.Y. Wu, D. G. Yang, G. Q. Zhang. A Novel Soldering Method to Evaluate PCB Pad Cratering for Pin-Pull Testing, Microelectronics Reliability, 53, pp1568¨C1574, 2013. (SCI ÊÕ¼, IF: 1.433)?[17]????? Yang, D.G., K.M.B. Jansen, L.G. Wang, L.J. Ernst, G.Q. Zhang, H.J.L. Bressers, X.J. Fan, ¡°Micromechanical modelling of stress evolution induced during cure in a particle-filled electronic packaging polymer¡±, IEEE Transactions on Components and Packaging Technologies, Vol.27, No. 4, pp: 676-683, 2004.¡¡ (SCI ÊÕ¼)[18]????? Yang, D. G., J. S. Liang, Q. Y. Li, L. J. Ernst and G. Q. Zhang, ¡°Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach¡±, Microelectronics Reliability, Vol. 44, No. 12, 2004, pp: 1947-1955.¡¡ (SCI ÊÕ¼)[19]????? Yang, D.G., G.Q. Zhang, L.J. Ernst, C. van't Hof, J.F.J. Caers, H.J.L. Bressers, J. Janssen, ¡°Investigation on Flip Chip Solder Joint Fatigue with Cure-Dependent Underfill Properties,¡± IEEE Transactions on Components and Packaging Technologies, Vol.26, No. 2, pp: 388-398, 2003.¡¡ (SCI ÊÕ¼)[20]? Yang, D.G., Wan, F.F., Shou, Z.Y., van Driel, W.D., Scholten, H., Goumans, L., Faria, R, Effect of high temperature aging on reliability of automotive electronics£¬Microelectronics Reliability£¬2011,51: 1938-1942¡£(SCIÊÕ¼)¹ú¼Ò×ÔÈ»¿Æѧ»ù½ðÏîÄ¿£º¡°´ó¹¦ÂÊLED ÕÕÃ÷µÆ¾ßµÄÍË»¯»úÀí¼°ÏµÍ³¿É¿¿ÐÔÑо¿¡±£¬201401-201712£¬ÏîÄ¿Ö÷³ÖÈË¡£?¹ú¼Ò¿Æ¼¼Ö§³Å¼Æ»®ÖصãÏîÄ¿£º ¡°LED¹âÔ´¼°µÆ¾ßÄͺòÐÔ¡¢Ê§Ð§»úÀíºÍ¿É¿¿ÐÔÑо¿¡±£¨Åú×¼ºÅ£º2011BAE01B14£©£¬201101-201312£¬¹ú²¦×ܾ­·Ñ600Íò£¬×Ó¿ÎÌâÖ÷³ÖÈË¡£¹ú¼Ò×ÔÈ»¿Æѧ»ù½ðÏîÄ¿£º¡°µç×Ó·â×°¾ÛºÏÎïµÄÈÈÑõ»¯ÐÐΪ¼°Æä¶Ô·â×°Æ÷¼þµÄÓ°Ï족£¬2015.1-201712£¬Ö÷Òª³ÉÔ±µÚ¶þ? ¡£¹ãÎ÷×ÔÈ»¿Æѧ»ù½ðÖصãÏîÄ¿¡°ÐÂÄÜÔ´Æû³µµç×ӵĸ߿ɿ¿ÐÔ·â×°ºÍÄ£¿é»¯×é×°µÄÈô¸É¹Ø¼ü¼¼ÊõÑо¿¡±£¨Åú×¼ºÅ£º2011GXNSFD018027£©£¬201103-201403£¬ÏîÄ¿Ö÷³ÖÈË¡£¹ãÎ÷½ÌÓýÌüÖØ´óÏîÄ¿£º¡°ÐÂÄÜÔ´µç¶¯Æû³µ¶¯Á¦ÏµÍ³¹Ø¼ü¼¼ÊõÑо¿¡±£¬201109-201409£¬ÏîÄ¿Ö÷³ÖÈË¡£ÆóҵίÍÐÏîÄ¿£º ¡°AFM-Based Packaging Technology for MEMS/Sensors¡±APC,NL£¬ºÉÀ¼Boschman Technologies£¬201103-201312£¬ ? 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